High precision kovar alloy 4j29 machining parts
Material:
4 j29 / W.N r. 1.3912 / AISI / ASTM F15 / JIS EMAS – 1001
Dimensions: 7-188mm
Material thickness: 0.8-4.0mm
Process: Stamping and machining
Product technical requirements:
After processing, the parts need to be purified by a hydrogen furnace so that the sealed glass surface has no bubbles to remove impurities such as carbon.
Application: Kovar Alloys for glass sealing
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Product Description:

Key Features:
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Material Excellence: Fabricated from Kovar Alloy 4J29 to offer matched thermal expansion with borosilicate glass and ceramics for leak-free, long-term sealing integrity.
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Precision Engineering: Carefully designed using the most recent CNC machining and forming technologies to deliver accurate dimensional tolerances (up to ±0.01mm) for complex geometries.
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Vacuum-Optimized Ideal for ultra-high vacuum (UHV) systems, electron devices, and hermetic enclosures Surface finishes and treatments used to minimize outgassing
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Robust Performance: Resistant to thermal cycling, corrosion, and mechanical stress; functional in temperatures ranging from -200°C to +450°C.
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Custom Solutions: Tailored to application requirements such as size, shape, joint configurations and metallization layers for brazing or welding.
Applications:
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Semiconductor & MEMS chip packaging
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Aerospace sensors and vacuum feedthroughs
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Encapsulation of medical implantable devices
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RF/microwave devices and laser/optical systems
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Power Electronics and Cryogenic Equipment with High Reliability
Why Choose Us?
Tap into our vacuum-grade metallurgy expertise and 40 years of precision sealing solution experience. We also provide complete technical support from prototype through volume production to ensure seamless integration into your mission critical systems.

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FAQ
You can tell us your needs (such as specifications, quantities, materials, drawings, etc.) by email(info@prekovar.com), phone or by submitting the form on our website.
With over 10 years of specialized focus on Kovar/alloy processing, we master the unique challenges of this low-expansion material. Our advanced stamping techniques ensure micron-level accuracy, ideal for critical applications in electronics, aerospace, and hermetic sealing components.











